High frequency module and array of the same
AssigneesDenso Corporation, National University Corporation Nagoya Institute of Technology
InventorsKunio Sakakibara, Yutaka Aoki
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Abstract
A high frequency module for converting a high frequency wave in a free space to a high frequency wave in a planar waveguide includes two metal plates, a dielectric substrate and a planar waveguide disposed on the dielectric substrate. The dielectric substrate between the two metal plates has the planar waveguide disposed thereon, and the planar waveguide protrudes either in a through hole bored in one of the two metal plates, or in a hollow space defined by the other of the two metal plates on the dielectric substrate.
Claims16
A high frequency module for converting high frequency wave in a free space to high frequency wave in a planar waveguide, the high frequency module comprising:
- two metal plates;
- a dielectric substrate;
- and
- a planar waveguide disposed on the dielectric substrate,
- wherein the dielectric substrate is positioned between the two metal plates,
- one of the two metal plates has a through hole,
- the planar waveguide disposed on the dielectric substrate on one side that faces the other of the two metal plates, and
- one of two ends of the planar waveguide is positioned in a projection area of the through hole projected substantially in an axial direction of the through hole onto the dielectric substrate.
A high frequency module for converting high frequency wave in a free space to high frequency wave in a planar waveguide, the high frequency module comprising:
- two metal plates;
- a dielectric substrate;
- and
- a planar waveguide disposed on the dielectric substrate,
- wherein the dielectric substrate is positioned between the two metal plates,
- one of the two metal plates has a through hole,
- the planar waveguide disposed on the dielectric substrate on one side that faces the one of the two metal plates, and
- one of two ends of the planar waveguide is positioned in a projection area of the through hole projected substantially in an axial direction of the through hole onto the dielectric substrate.
Dependencies are inferred from the claim text.