Semiconductor device and an image sensing device

A semiconductor device comprising:

• a package substrate which has a plurality of electrodes for external connection arrayed over one face and a plurality of bonding pads arranged along the edges of the other face;
• a first semiconductor chip mounted over said other face of said package substrate;
• and
• a second semiconductor chip disposed over said first semiconductor chip,
• wherein said first semiconductor chip has along edges a plurality of bonding pads, some of which are a plurality of bonding pads for analog signals,
• wherein said second semiconductor chip has along edges a plurality of bonding pads, some of which are a plurality of bonding pads for digital signals,
• wherein first bonding pads of the package substrate to be connected to the bonding pads of said first semiconductor chip are arranged farther than the edges of said package substrate than second bonding pads of the package substrate to be connected to the bonding pads of said second semiconductor chip, and
• said package substrate has first wirings to connect said first bonding pads, to be connected to the bonding pads for analog signals of said first semiconductor chip, to electrodes for external connection arranged outermost on the array.

A semiconductor device comprising:

• a package substrate which has a plurality of electrodes for external connection arrayed over one face and a plurality of bonding pads arranged along the edges of the other face;
• a second semiconductor chip mounted over said other face of said package substrate;
• and
• a first semiconductor chip disposed over said second semiconductor chip,
• wherein said first semiconductor chip has along edges a plurality of bonding pads, some of which are a plurality of bonding pads for analog signals,
• wherein said second semiconductor chip has along edges a plurality of bonding pads, some of which are a plurality of bonding pads for digital signals,
• wherein first bonding pads of the package substrate to be connected to the bonding pads of said first semiconductor chip are arranged closer to the edges of said package substrate than second bonding pads of the package substrate to be connected to the bonding pads of said second semiconductor chip, and
• wherein said package substrate has first wirings to connect said first bonding pads, to be connected to the bonding pads for analog signals of said first semiconductor chip, to electrodes for external connection arranged outermost on the array.