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US 2006/0220668 A1Published application
Method for manufacturing semiconductor device
AssigneeRenesas Technology Corp.
InventorsEisaku Yamashita, Shigeru Takada
Life of this patent
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Abstract
A burn-in input signal input to a burn-in circuit is delivered to an internal circuit through a selector. In response to a control signal from the burn-in circuit, the selector selects either the burn-in input signal or an input signal for operating the internal circuit. In the burn-in test process, a portion of an output signal is monitored to determine the degree of degradation of the internal circuit.
Claims11
A method for manufacturing a semiconductor device, comprising the steps of:
- arranging a semiconductor device, a burn-in test device, and a burn-in board so as to be able to test said semiconductor device by use of said burn-in test device and said burn-in board, wherein said burn-in board has a first socket having fewer contact pins than there are terminals on said semiconductor device;
- electrically connecting some of said terminals to said contact pins;
- and
- supplying a burn-in input signal from said burn-in test device to said semiconductor device to perform a burn-in test.
1 more element
Dependencies are inferred from the claim text.