Alignment fences and devices and assemblies including the same
OwnerSalman Akram, Alan Wood +1inventors
InventorsSalman Akram, Alan Wood, Warren Farnworth
Life of this patent
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Abstract
A fence is configured to receive and align a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.
Claims22
A substrate configured to have a semiconductor device at least temporarily electrically connected thereto, comprising:
- a substantially planar member;
- a first array of contacts exposed at a surface of the substantially planar member;
- and
- a fence including a receptacle for receiving the semiconductor device, the receptacle including at least one laterally recessed area in a corner thereof for receiving a corner of a semiconductor device.
A fence configured for use with a substantially planar substrate, comprising:
- a plurality of adjacent, mutually adhered regions;
- and
- a receptacle defined by the plurality of adjacent, mutually adhered regions and including at least one side wall configured to progressively guide contact pads of at least one semiconductor device structure into alignment with corresponding contacts of the substantially planar substrate.
Dependencies are inferred from the claim text.