Electronic device substrate, electronic device, method of manufacturing electronic device, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorMinoru Koyama
Life of this patent
Estimating the term…
Abstract
An electronic device substrate includes an insulating plate base, an electronic circuit formed on one surface of the base, and a conductive film formed on the other surface of the base and having electrical conductivity. The electronic device substrate is completed through a manufacturing process including charge-removal movement in which removal of a charge of the base is combined with movement of the electronic device substrate. In the charge-removal movement, the electronic device substrate is moved with being supported by a substrate support part that has electrical conductivity and is grounded. The substrate support part abuts the conductive film during the charge-removal movement.
Claims13
An electronic device substrate comprising:
- an insulating plate base;
- an electronic circuit formed on one surface of the base;
- and
- a conductive film formed on the other surface of the base and having electrical conductivity, wherein:
- the electronic device substrate is completed through a manufacturing process including charge-removal movement in which removal of a charge of the base is combined with movement of the electronic device substrate;
- in the charge-removal movement, the electronic device substrate is moved with being supported by a substrate support part that has electrical conductivity and is grounded, and the substrate support part abuts the conductive film during the charge-removal movement.
A method of manufacturing an electronic device, comprising:
- completing an electronic device substrate that has an insulating plate base and an electronic circuit formed on one surface of the base, through a manufacturing process including movement of the electronic device substrate in association with removal of a charge of the base, the electronic device substrate having a conductive film that is formed on part of the other surface of the base and has electrical conductivity, the electronic device substrate being moved, in the movement, with being supported by a substrate support part that has electrical conductivity and is grounded, the substrate support part abutting the conductive film during the movement;
- and
- mounting the electronic device substrate in a casing that has an electrically conductive coating formed on the inside surface of the casing, so that the conductive film is brought into contact with the coating on the inside surface of the casing.
Dependencies are inferred from the claim text.