US 2006/0220500 A1 · Method for manufacturing surface acoustic wave device

Abstract

A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

Claims11

Dependent claims

1-11. (canceled)

A method for manufacturing a surface acoustic wave device in which a surface acoustic wave element having one principal surface formed with a connector electrode and a periphery sealing electrode is joined to a base substrate formed with an electrode for connection to the element connected to the connector electrode, a periphery sealing conductor film connected to the periphery sealing electrode and an external terminal electrode so that a predetermined gap is formed between the base substrate and the surface acoustic wave element, the method comprising the steps of:

forming a first solder bump for a solder bump component on either of the electrode for connection to the element of the base substrate and the connector electrode of the surface acoustic wave element;
forming a second solder bump having a height smaller than that of the first solder bump on either of the periphery sealing conductor film of the base substrate and the periphery sealing electrode of the surface acoustic wave element;
electrically connecting and temporarily fixing the electrode for connection to the element of the base substrate to the connector electrode of the surface acoustic wave element by means of the first solder bump;
and
thereafter fusing the first solder bump and the second solder bump in a predetermined atmosphere so that the periphery sealing conductor film of the base substrate and the periphery sealing electrode of the surface acoustic wave element are hermetically sealed and joined to each other by means of the second solder bump.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/445,586Filed 1 Jun 2006

Priority

JP 2002-22258231 Jul 2002

Published

5 Oct 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

H03H 9/1085
For surface acoustic wave [SAW] devices: the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
G01H 3/12
Amplitude; Power: by electric means
H03H 3/08
For the manufacture of electromechanical resonators or networks: for the manufacture of resonators or networks using surface acoustic waves
H03H 9/059
For surface acoustic wave devices: consisting of mounting pads or bumps

Method for manufacturing surface acoustic wave device

Life of this patent

Method for manufacturing surface acoustic wave device

Life of this patent

Abstract

Claims11