Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

A mounting method of a semiconductor device, comprising:

• preparing a substrate on which an electroconductive film, an insulating film and an anisotropic electroconductive binding material are provided, the insulating film being formed on the electroconductive film and being provided with an opening portion to expose a part of the electroconductive film therefrom and having an internal stress set to serve as a compression stress, the anisotropic electroconductive binding material being disposed on the part of the electroconductive film exposed by the opening portion and on the insulating film;
• and
• disposing a semiconductor device having a plurality of electrodes on the anisotropic electroconductive binding material, thereby electrically connecting the plurality of electrodes with the electroconductive film through the anisotropic electroconductive binding material.