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US 2006/0220263 A1Published application
Semiconductor device to be applied to various types of semiconductor package
AssigneeElpida Memory, Inc.
InventorsToshihiro Waki, Sadayuki Okuma
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Abstract
A plurality of first pads for bonding is arranged in a central portion of a semiconductor device in a longitudinal direction of the device. In an edge portion of the semiconductor device, a plurality of second pads for bonding is arranged in the longitudinal direction of the device. The first pad and the second pad are connected by a wiring.
Claims4
A semiconductor device comprising:
- a plurality of first pads for bonding, arranged in a central portion of said semiconductor device;
- a plurality of second pads for bonding, arranged in an edge portion of said semiconductor device;
- and
- a wiring for connecting said first pad and said second pad.
1 more element
Dependencies are inferred from the claim text.