Stacked die package
AssigneeInfineon Technologies AG
InventorsTorsten Meyer, Harry Hedler
Life of this patent
Estimating the term…
Abstract
A stacked die package includes a substrate or interposer board that includes a contact area on a top surface and landing pads surrounding the contact area. Solder pads are disposed on an opposite side of the substrate. The solder pads are electrically connected with the landing pads by inner board wiring. A reconstituted die, which includes a die surrounded by a frame, is mounted over the substrate. A top die is mounted over the reconstituted die. Both the reconstituted die and the top die are electrically connected to the substrate, e.g., by wire bonds.
Claims20
A stacked die package, comprising:
- a substrate;
- a contact area on a top surface of the substrate and landing pads surrounding the contact area;
- solder pads on an opposite side of the substrate, the solder pads being electrically connected with the landing pads by inner board wiring;
- a reconstituted die that includes a die surrounded by a frame, the reconstituted die mounted over the substrate;
- and
- a top die mounted over the reconstituted die.
A stacked die package, comprising
- a substrate;
- a contact area on a top surface of the substrate;
- landing pads on the top surface of the substrate surrounding the contact area;
- solder pads on an opposite side of the substrate, the solder pads being electrically connected with the landing pads by inner board wiring;
- a first reconstituted die mounted on the contact area of the substrate board;
- and
- further reconstituted dies mounted on top of each other on the first reconstituted die, each reconstituted die including a frame, wherein the dimensions of the frames are smaller for each reconstituted die located from the first reconstituted die to a top reconstituted die.
A method of manufacturing a reconstituted die, the method comprising:
- providing a carrier plate with an adhesive on its surface;
- placing dies on the adhesive leaving gaps between adjacent dies;
- wafer molding of the placed dies with a mold encapsulant such that the gaps between the dies are filled with the encapsulant;
- delaminating the carrier;
- generating a redistribution layer over an active surface of each die;
- and
- separating the dies to form reconstituted dies by dicing such that each die is surrounded by an individual frame.
Dependencies are inferred from the claim text.