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US 2006/0220259 A1Published application
Multi-chip structure and method of assembling chips
AssigneeMegica Corporation
InventorsKe-Hung Chen, Shih-Hsiung Lin, Mou-Shiung Lin
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Abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
Claims7
A multi-chip structure comprising:
- a first chip;
- a second chip;
- at least a conductive pillar on the first chip;
- a conductive connecting material connecting said conductive pillar to said second chip;
- an underfill material filling a gap between said first chip and said second chip;
- and
- at least one embankment structure disposed on said second chip for protecting a wire-bonding pad of said second chip from being contaminated by said underfill material.
4 more elements
Dependencies are inferred from the claim text.