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US 2006/0220256 A1Published application
Encapsulant cavity integrated circuit package system
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Shim, Byung Han, Kambhampati Ramakrishna, Seng Chow
Life of this patent
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Abstract
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
Claims20
An encapsulant cavity integrated circuit package system comprising:
- forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer;
- and
- attaching a component on the interposer in the encapsulant cavity.
An encapsulant cavity integrated circuit package system comprising:
- mounting a first integrated circuit on a first surface of an interposer;
- molding a first encapsulant over the first integrated circuit forming a first integrated circuit package;
- mounting the first integrated circuit package with an inverted bottom terminal over a substrate;
- molding a second encapsulant over the first integrated circuit package with the inverted bottom terminal and the substrate forming an encapsulant cavity having a second surface of the interposer substantially exposed;
- and
- mounting a component on the second surface of the interposer in the encapsulant cavity.
3 more elements
An encapsulant cavity integrated circuit package system comprising:
- a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer;
- and
- a component on the interposer in the encapsulant cavity.
Dependencies are inferred from the claim text.