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US 2006/0220253 A1Published application
Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device
OwnerYoshitaka Hamada, Fujio Yagihashi +2inventors
InventorsYoshitaka Hamada, Fujio Yagihashi, Hideo Nakagawa, Masaru Sasao
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Abstract
A porous film-forming composition comprising (A) a curable silicone resin having a Mn of at least 100, (B) a micelle-forming surfactant, and (C) a compound which generates an acid upon pyrolysis remains stable during storage. The composition is coated and heat treated to form a porous film which has flatness, uniformity, a low dielectric constant and a high mechanical strength so that it is best suited as an interlayer dielectric film in the fabrication of semiconductor devices.
Claims10
A porous film-forming composition comprising:
- (A) 100 parts by weight of a curable silicone resin having a number average molecular weight of at least 100;
- (B) 5 to 50 parts by weight of a micelle-forming surfactant;
- and
- (C) 0.01 to 10 parts by weight of a compound which generates an acid upon pyrolysis.
1 more element
Dependencies are inferred from the claim text.