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US 2006/0220246 A1Published application
Bump land structure of circuit substrate for semiconductor package
OwnerKil-Soo Kim, In-Sook Junginventors
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Abstract
A bump land structure of a circuit substrate for a semiconductor package may have a combination of an SMD type bump land structure and an NSMD type bump land structure. A lower portion of a solder mask and a lower layer of a bump land may form the SMD type bump land structure. An upper portion of a solder mask and an upper layer of a bump land may form the NSMD type bump land structure.
Claims22
A circuit substrate comprising:
- a substrate core;
- a bump land provided on the substrate core, the bump land including a lower layer provided on the substrate core, and an upper layer provided on the lower layer;
- and
- a solder mask provided on the substrate core, the solder mask including a lower portion provided on the substrate core, and an upper portion provided on the lower portion, the lower portion covering a top peripheral region of the lower layer of the bump land, and the upper portion exposing a top face of the upper layer of the bump land.
1 more element
A circuit substrate comprising:
- a substrate core;
- a bump land provided on the substrate core, the bump land including a lower layer provided on the substrate core, at least one intermediate layer provided on the lower layer, and an upper layer provided on the at least one intermediate layer;
- and
- a solder mask provided on the substrate core, the solder mask including a lower portion provided on the substrate core, the lower portion covering a top peripheral region of the lower layer of the bump land and surrounding a side face of the at least one intermediate layer of the bump land, and an upper portion provided on the lower portion and exposing a top face and a side face of the upper layer of the bump land.
1 more element
A bump land structure comprising:
- a bump land including
- a lower layer having a major surface with a mounting region and a peripheral region contiguous with and surrounding the mounting region, and
- an upper layer provided on the mounting region of the major surface of the lower layer;
- and
- a solder mask covering the entire peripheral region of the major surface of the lower layer of the bump land.
2 more elements
A method of manufacturing a bump land structure, the method comprising:
- providing a bump land lower layer having a major surface with a mounting region and a peripheral region contiguous with and surrounding the mounting region;
- providing a bump land upper layer on the mounting region of the major surface of the bump land lower layer;
- and
- providing a solder mask covering the entire peripheral region of the major surface of the bump land lower layer.
1 more element
Dependencies are inferred from the claim text.