Flip chip package and the fabrication thereof

A flip-chip package, comprising:

• a chip having a plurality of die pads;
• a chip carrier having a plurality of bump pads respectively corresponding to the die pads;
• and
• an interposer between the chip and the chip carrier having a plurality of conductive elements respectively corresponding to the die pads, wherein each conductive element has a first end electrically connected to one of the die pads and a second end electrically connected to one of the bump pads.

A fabricating method of a flip-chip package, comprising:

• providing a chip which has a plurality of die pads;
• providing a chip carrier which has a plurality of bump pads respectively corresponding to the die pads;
• providing an interposer which comprises an insulation layer, a first adhesive layer disposed on a first surface of the insulation layer, a second adhesive layer disposed on a second surface of the insulation layer, and a plurality of conductive elements passing through the insulation layer, the first adhesive layer and the second adhesive layer;
• stacking and aligning the chip, the interposer, and the chip carrier, wherein the interposer is disposed between the chip and the chip carrier;
• and
• bonding the chip, the interposer, and the chip carrier, such that one of the die pads on the chip and one of the bump pads on the chip carrier are electrically connected through one of the conductive elements.