Contact pad and bump pad arrangement for high-lead or lead-free bumps
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu Lu, Hsin-Hui Lee, Chung Wang, Mirng-Ji Lii
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Abstract
A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.
Claims23
A semiconductor package assembly comprising:
- a first conductive pad on a semiconductor substrate;
- a second conductive pad on a package substrate;
- a substantially lead-free bump physically coupled between the first conductive pad and the second conductive pad;
- wherein the bump has a first interface with the first conductive pad, the first interface having a first linear dimension;
- wherein the bump has a second interface with the second conductive pad, the second interface having a second linear dimension;
- and
- wherein the first linear dimension and the second linear dimension has a ratio of between about 0.7 and about 1.7.
A semiconductor package assembly comprising:
- a first conductive pad on a semiconductor substrate;
- a second conductive pad on a package substrate;
- a substantially high-lead-containing bump physically coupled between the semiconductor substrate and the package substrate;
- wherein the bump has a first interface with the first conductive pad, the first interface having a first linear dimension;
- wherein the bump has a second interface with the second conductive pad, the second interface having a second linear dimension;
- and
- wherein the first linear dimension and the second linear dimension has a ratio of between about 0.7 and about 1.7.
A semiconductor package assembly comprising:
- a contact pad having a first linear dimension on a semiconductor substrate;
- a bump pad having a second linear dimension on a package substrate;
- the ratio of the first linear dimension and the second linear dimension being between about 0.7 and about 1.7;
- and
- a bump physically connecting the contact pad and the bump pad wherein the bump is substantially lead-free, comprising less than about 5 percent lead, or substantially high-lead-containing, comprising more than about 80 percent lead.
Dependencies are inferred from the claim text.