Electronic device package
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Yong Du
Life of this patent
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Abstract
An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utilizes a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In an alternate embodiment, the package utilizes a material having a coefficient of thermal expansion α2 of less than about 400 (four-hundred) ppm (parts per million)/° C. for attaching the die to the substrate. In another alternate embodiment, the package utilizes a rigid material for attaching the die to the substrate.
Claims79
An electronic system package comprising:
- a circuit board;
- a die;
- and
- a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals at a solder reflow temperature of between about 200 degrees Centigrade and 280 degrees Centigrade, the material attaching the die to the circuit board.
An electronic system package, comprising:
- a circuit board;
- a die;
- and
- a material having a coefficient of thermal expansion a2 of less than about 400 (four-hundred) ppm/° C. at a solder reflow temperature of about between about 200 degrees Centigrade and about 280 degrees Centigrade, the material attaching the die to the circuit board.
An electronic system package, comprising:
- a circuit board;
- a die;
- and
- a rigid die attach material attaching the die to the substrate.
An integrated circuit package, comprising:
- a ceramic substrate;
- a die;
- and
- a material having a low coefficient of thermal expansion attaching the die to the substrate.
A method of packaging a die, the method comprising:
- positioning a die on a substrate;
- providing a die attach material having a Young's modulus of between about 0.1 megapascal and 20 megapascals, at a solder reflow temperature, to secure the die to the substrate;
- and
- reflowing one or more solder balls in contact with the substrate and a board.
A method of packaging a die, the method comprising:
- positioning a die on a substrate;
- and
- providing a die attach material having a coefficient of thermal expansion of less than about 400 (four-hundred) to secure the die to the substrate.
An apparatus comprising:
- a die;
- a first substrate having a top surface that is attached to a bottom surface of the die with a die attach material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals;
- a second substrate having a top surface that is attached to the bottom surface of the die with the die attach material;
- and
- a board having a top surface that is attached to a bottom surface of the first substrate with a first set of one or more solder balls and wherein the top surface of the board is attached to a bottom surface of the second substrate with a second set of one or more solder balls.
An apparatus comprising:
- a die;
- a substrate having a top surface that is attached to a bottom surface of the die with a die attach material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals, wherein the top surface of the substrate is electrically coupled to the top surface of the die using one or more bonding wires;
- and
- a board having a top surface that is attached to a bottom surface of the substrate with one or more solder balls.
Dependencies are inferred from the claim text.