Packaged semiconductor device and method of manufacture using shaped die
AssigneeFairchild Semiconductor Corporation
InventorsNeill Thornton, Dennis Lang
Life of this patent
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Abstract
A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
Claims13
-20. (canceled)
A method for making semiconductor device, the method comprising:
- obtaining a die having a first surface and a second surface opposite to the first surface and side surfaces, one or more edges along the first surface of the die being notched to form one or more shaped edges;
- attaching a lead frame to the second surface of the die;
- and
- encapsulating the die and the lead frame to form a body, wherein portions of the lead frame extend out of the body, and wherein the body has a window defined therein,
- wherein after encapsulating, the die is positioned with respect to the body such that the first surface of the die is exposed through the window, and
- wherein the die comprises a power MOSFET and wherein the first surface of the die has a metallization layer providing a drain terminal of the MOSFET, wherein an exterior surface of the metallization layer is substantially coplanar with an exterior surface of the body after encapsulating.
A method comprising:
- forming a semiconductor device comprising (a) a semiconductor device comprising a die having a first surface and a second surface opposite to the first surface, and side surfaces, one or more edges along the first surface of the die being notched to form one or more shaped edges, (b) a lead frame coupled to the second surface of the die, and (c) a body encapsulating the die and the lead frame with portions of the lead frame extending out of the body, the body having a window defined therein, wherein the die is positioned with respect to the body such that the first surface of the die is exposed through the window, wherein the first surface of the die protrudes from the window exposing portions of the one or more shaped edges;
- and
- mounting the semiconductor device to a circuit board, wherein the first surface of the die and the circuit board are electrically connected through the first surface of the die.
A method for forming a semiconductor device comprising:
- obtaining a die having a first surface and a second surface opposite to the first surface, and side surfaces, one or more edges along the first surface of the die being notched to form one or more shaped edges;
- attaching the die to a lead frame comprising leads coupled to the second surface of the die;
- and
- encapsulating the die and the lead frame, wherein the body defines a window,
- wherein the die is positioned with respect to the body such that the first surface of the die is exposed through the window, and
- wherein the die comprises a power MOSFET and wherein the first surface of the die has a metallization layer providing a terminal of the MOSFET, wherein an exterior surface of the metallization layer is substantially coplanar with an exterior surface of the body, and
- wherein the leads extend laterally from the body and have surfaces that are substantially coplanar with the exterior surface of the metallization layer and the exterior surface of the body.
Dependencies are inferred from the claim text.