Semiconductor device module and manufacturing method of semiconductor device module
AssigneeSharp Kabushiki Kaisha
InventorsYoshinori Tanida, Kazuya Fujita
Life of this patent
Estimating the term…
Abstract
In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image pickup element as a semiconductor element is covered with a cover, and a holder as a lid is placed over the cover.
Claims15
A semiconductor device module comprising:
- a substrate on which a conductor wiring is formed;
- a semiconductor element connected to the conductor wiring with an electrically conductive wire;
- a lid placed to face said semiconductor element;
- and
- a cover for covering a part or all of the electrically conductive wire,
- wherein said lid is placed over said cover.
A manufacturing method of a semiconductor device module comprising a substrate on which a conductor wiring is formed, a semiconductor element connected to the conductor wiring with an electrically conductive wire, and a lid with a leg part placed to face said semiconductor element, comprising:
- a step of placing said semiconductor element on said substrate and connecting said semiconductor element and said substrate with the electrically conductive wire;
- a bonding step of placing the leg part on said substrate and bonding the lid to said substrate;
- and
- a sealing step of sealing a gap between said substrate and said lid by covering a part or all of the electrically conductive wire with said cover.
A manufacturing method of a semiconductor device module comprising a substrate on which a conductor wiring is formed, a semiconductor element connected to the conductor wiring with an electrically conductive wire, and a lid placed to face said semiconductor element, comprising:
- a step of placing said semiconductor element on said substrate and connecting said semiconductor element and said substrate with the electrically conductive wire;
- a covering step of covering a part or all of the electrically conductive wire with a cover;
- and
- a fixing step of fixing a position of said lid with respect to said substrate by placing said lid on said cover.
Dependencies are inferred from the claim text.