Methods and apparatus for a flexible circuit interposer

A flexible circuit interposer comprising:

• a substantially flexible substrate having a top surface and a bottom surface;
• a first set of pads configured in a first pad pattern on the bottom surface;
• a second set of pads configured in a second pad pattern on the top surface, wherein the second pad pattern is substantially the same as the first pad pattern, and each of the pads in the second set of pads is electrically continuous with a corresponding pad in the first set of pads;
• a third set of pads configured in a third pad pattern on the top surface, wherein the third pad pattern is substantially the same as the first pad pattern;
• at least one conductive trace connecting a pad in the second set of pads with a spatially corresponding pad in the third set of pads;
• and
• a bending region between the second set of pads and the third set of pads.

A flexible circuit interposer comprising:

• a substantially flexible substrate having a top surface and a bottom surface;
• a first set of pads configured in a first pad pattern on the bottom surface;
• a second set of pads configured in a second pad pattern on the top surface, wherein the second pad pattern is substantially the same as the first pad pattern, and each of the pads in the second set of pads is electrically continuous with a corresponding pad in the first set of pads;
• a third set of pads configured in a third pad pattern on the top surface, wherein the third pad pattern is substantially the same as the first pad pattern;
• at least one conductive trace connecting a pad in the second set of pads with a spatially corresponding pad in the third set of pads;
• and
• a bending region between the first set of pads and the second set of pads.

A flexible circuit interposer comprising:

• a substantially flexible substrate having a top surface and a bottom surface;
• a first set of pads configured in a first pad pattern on the bottom surface;
• a second set of pads configured in a second pad pattern on the top surface, wherein at least one of the pads in the second set of pads is electrically continuous with a pad in the first set of pads;
• a third set of pads configured in a third pad pattern on the top surface;
• a conductive trace connecting a pad in the third set of pads with one of a pad in the first set of pads and a pad in the second set of pads;
• and
• a bending region between the second set of pads and one of the first set of pads and the third set of pads.