High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same
AssigneeData Device Corporation
InventorLen Marro
Life of this patent
Estimating the term…
Abstract
High density integrated circuits and more particularly to a high density integrated circuit incorporating a multiplicity of functional chips arranged on a substrate comprised of a plurality of dielectric and conductive layers which interface the semiconductor dies with a ball gate array (BGA) arranged on the underside of the substrate and wherein the main heat generating areas of the semiconductor dies are directly coupled to selected balls of the BGA for directly carrying heat from the major heat sources away from the device.
Claims16
A multi-die package assembly, comprising
- a multilayer substrate comprised of a plurality of conductive layers with a plurality of dielectric layers in alternating fashion;
- a plurality of dies arranged on a top surface of said substrate, each die having a plurality of die terminals selectively coupled to substrate terminals of said top surface;
- a plurality of conductive balls arranged on a bottom surface of said substrate in a matrix of rows and columns comprising a ball grid array (BGA);
- at least one pair of electrical connection vias extending in a direction transverse to said layers and electrically coupled to at least one selected conductive layer for selectively coupling die terminals of different dies to one another and at least another transverse aligned via coupled to at least a given one of said balls for providing an electrical connection of a die terminal to an external circuit;
- and
- heat conducting vias extending in a direction transverse to said layers and insulated from said conductive layers for coupling high heat generating regions of said dies to heat conducting balls other than said electrical connection balls for conducting heat away from said dies.
The assembly of claim 2 wherein said heat conducting vias extend directly from said high heat generating areas to said heat conducting balls.
A method for producing a multi-die package assembly which provides a significantly reduced footprint, comprising:
- forming a multi-layer substrate comprised of individual insulating layers each having a conductive layer;
- removing at least a portion of each conductive layer to form a printed wiring pattern;
- drilling holes in each insulating layer in accordance with a given drilling pattern;
- through-plating selected ones of the drill holes in said insulating layers to provide a conductive path between the upper and lower surfaces of each drilled opening;
- stacking said insulating layers one upon the other in a given pattern;
- mounting die assemblies on a top surface of a top insulating layer of said stack of layers;
- wire bonding selected terminals of said dies to selected conductive terminals on said top surface of said top insulating layer;
- providing a ball grid array on a printed wiring pattern provided on a bottom surface of a bottom insulating layer;
- wherein at least one terminal of one of said plurality of dies is electrically connected to at least one terminal of another one of said dies by an electrical path extending between said one terminal, at least one plated through hole, at least one printed wiring pattern of one of said layers of said substrate beneath said top layer, another plated hole and said other terminal of said other one of said dies;
- and
- wherein at least selected plated holes of all of said insulating layers form a continuous heat conducting path between a heat generating region of one of said dies and at least one ball of said BGA.
Dependencies are inferred from the claim text.