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US 2006/0220226 A1Published application
Integrated heat spreader with intermetallic layer and method for making
AssigneeIntel Corporation
InventorsMukul Renavikar, Susheel Jadhav
Life of this patent
Estimating the term…
Abstract
Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein.
Claims18
1-16. (canceled)
An integrated circuit package comprising:
- a semiconductor die having a first side and an opposite second side;
- a metallization layer coupled to the first side, the metallization layer including an adhesion layer and a diffusion layer having a first side and a second side, and the adhesion layer being disposed between the second side of the diffusion layer and the first side of the semiconductor die to prevent the adhesion layer from reacting with a material disposed on a first side of the diffusion layer;
- an integrated heat spreader;
- a post-reaction thermal interface material, including an intermetallic compound, coupling a die side of the integrated heat spreader to the metallization layer;
- and
- a substrate having a surface, the semiconductor die second side coupled to the surface.
3 more elements
A system comprising:
- at least one integrated circuit package having:
- a semiconductor die having a first side and an opposite second side;
- a metallization layer coupled to the first side, the metallization layer including:
- an adhesion layer disposed adjacent to the first side;
- and a diffusion layer having a first side and a second side, with the adhesion layer disposed adjacent to the second side of the diffusion layer, so that the diffusion layer prevents the adhesion layer from reacting with a material disposed on a first side of the diffusion layer;
- an integrated heat spreader;
- and
- a post-reaction thermal interface material, including an intermetallic compound, coupling a die side of the integrated heat spreader to the metallization layer;
- a substrate having a surface, the semiconductor die second side coupled to the surface;
- a bus coupled to the at least one integrated circuit package;
- and
- a disk storage device coupled to the bus.
9 more elements
Dependencies are inferred from the claim text.