Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the Same

A method of fabricating a thermally enhanced three-dimensional package comprising:

• providing a first chip package, wherein the first chip package comprises a first substrate;
• disposing a heat sink having a first opening and a stiffener ring inside the first opening on the first chip package, wherein the stiffener ring comprises a first surface and a second surface and the first substrate of the first chip package is disposed in the opening of the heat sink and secured to the first surface of the stiffener ring;
• disposing a second chip package having a second substrate on the heat sink, wherein the second substrate is secured to the second surface of the stiffener ring;
• and
• performing a reflow process for forming a plurality of solder balls between the first substrate and the second substrate, wherein the solder balls are formed inside the stiffener ring for connecting the first substrate and the second substrate.

A thermally enhanced three-dimensional package comprising:

• a heat sink having an opening, and a first surface and a second surface in the opening;
• a first chip package having a first substrate, wherein the first substrate is secured to the first surface;
• a second chip package having a second substrate, wherein the second substrate is secured to the second surface;
• and
• a plurality of solder balls connected to the first chip package and the second chip package, wherein the first chip package and the second chip package are stacked over each other.