Reactive nano-layer material for MEMS packaging
OwnerDaoqiang Lu, John Heckinventors
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Abstract
According to one embodiment an apparatus and method for MEMS packaging including a reactive nano-layer is presented. The apparatus comprises a substrate, an environmentally sensitive device on the substrate, a cap to fit over the device, and a hermetic seal between the cap and the substrate. The hermetic seal comprises a solder layer, and a reactive layer including one or more elements that react together through an initiating energy to emit exothermic heat to melt the solder layer.
Claims20
An apparatus, comprising:
- a substrate;
- an environmentally sensitive device on the substrate;
- a cap to fit over the device;
- and
- a hermetic seal between the cap and the substrate, the hermetic seal comprising:
- a solder layer;
- and
- a reactive layer including one or more elements that react together to emit exothermic heat to melt the solder layer.
The apparatus of 1, wherein the one or more elements of the reactive layer are alternatively deposited in nanoscale layers ranging from 1 to 1000 nm thickness.
A method, comprising:
- depositing a solder material on a first wafer;
- depositing a reactive material on at least one of the first wafer and a second wafer;
- applying an initiating energy to the reactive material to create a reaction in the reactive material;
- and
- forming a sealing ring between the first wafer and the second wafer by melting the solder material with exothermic heat emitted from the reaction of reactive material.
A hermetically sealed micro-electromechanical system (MEMS), comprising:
- a MEMS device disposed on a substrate;
- a cap to fit over the MEMS device;
- and
- a hermetic sealing ring formed between the cap and the substrate, the sealing ring comprising:
- a solder layer;
- and
- a reactive layer including one or more elements that react together to emit exothermic heat to melt the solder layer.
Dependencies are inferred from the claim text.