Electronic device and method for fabricating the same

Abstract

The electronic device comprises a first substrate 10; a first electrode 22 formed on one primary surface of the first substrate 10; a first resin layer 32 of a thermosetting resin formed on said one primary surface of the first substrate 10, burying the first electrode 22; a second substrate 12 opposed to said one primary surface of the first substrate 10; a second electrode 24 formed on one primary surface of the second substrate 12 opposed to the first substrate 10, corresponding to the first electrode 22 and jointed to the first electrode 22; and a second thermosetting resin layer 42 formed of a thermosetting resin formed on one primary surface of the second substrate 12, burying the second electrode 24, and adhered to the first resin layer 32. The fist electrodes 22 and the second electrodes 24 can be caused to joint to each other by the shrinkage of the first resin layer 32 and the second resin layer 42. The present invention can provide an electronic device having the first electrodes 22 and the second electrodes 24 surely jointed to each other without deteriorating the reliability.

Dependencies are inferred from the claim text.