Embedded-type power semiconductor package device

Abstract

An embedded-type power semiconductor package device that can clasp an isolating material over a semiconductor die in the inside thereof that through a two-fold strategy reduces the impact force during the embedding process, which includes a pin, a semiconductor die, and a cup. The cup is formed with a cup cavity, an inner wall, a groove and a heat-conductive seat. The heat-conductive seat has an annular retaining wall that is longitudinally protruding from a periphery thereof and a clasping wall that is transversely protruding from a periphery thereof. A cushion sleeve is annularly disposed in the groove and contacted with the inner wall. An insulating material is spread around the semiconductor die and the pin, thereby isolating the semiconductor die from the untouched area. The cup cavity is cast with an isolating material. The clasping wall can hold the isolating material in the cup cavity.

Dependencies are inferred from the claim text.