High precision connector member and manufacturing method thereof
AssigneeJapan Aviation Electronics Industry, Limited
InventorsTakushi Yoshida, Seiya Takahashi, Hiroshi Akimoto
Life of this patent
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Abstract
The connection member has a conductor portion (13) and a dummy pattern portion (15) both formed of a metallic conductor and arranged on a base (11). The conductor portion (13) and the dummy pattern portion (15) are formed by etching. The dummy pattern portion (15) has a positioning portion (21) formed by etching away the metallic conductor. The base (11) has a positioning hole (21) formed by applying laser light having a wavelength of 1500 nm or more to the positioning portion.
Claims14
A connection member comprising:
- an insulating base;
- a conductor portion arranged on the base;
- and
- a dummy pattern portion arranged on the base, wherein:
- the conductor portion and the dummy pattern portion are formed by etching a metallic conductor formed on the base;
- the dummy pattern portion has a positioning portion formed by etching away a part of the metallic conductor;
- and
- the base has a positioning hole formed in correspondence with the positioning portion by being irradiated with laser light having a wavelength of 1500 nm or more.
A connection member comprising:
- an insulating base;
- a conductor portion arranged on the base;
- and
- a pair of dummy pattern portions arranged on the base to be adjacent to each other, the conductor portion and the dummy pattern portions being formed by etching a metallic conductor formed on the base.
A method of manufacturing a connection member including an insulating base and a conductor portion arranged on the base, the method comprising the steps of:
- forming a conductor pattern of the metallic conductor on the base;
- etching the conductor pattern to form the conductor portion and the dummy pattern portion;
- etching a part of the dummy pattern portion to remove the metallic conductor and thereby form a positioning portion;
- and
- irradiating the positioning portion with laser light having a wavelength of 1500 nm or more to form in the base a positioning hole corresponding to the positioning portion.
A method of manufacturing a connection member including an insulating base and a conductor portion arranged on the base, the method comprising the steps of:
- forming a conductor pattern of the metallic conductor on the base;
- etching the conductor pattern to form a pair of dummy pattern portions each of which is adjacent to the conductor portion;
- and
- irradiating the dummy pattern portions with laser light having a wavelength of 1500 nm or more to cut the base.
Dependencies are inferred from the claim text.