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US 2006/0220212 A1Published application
Stacked package for electronic elements
OwnerShou-Lung Chen, Fang-Jun Leu +2inventors
InventorsShou-Lung Chen, Fang-Jun Leu, I-Hsuan Peng, Shan-Pu Yu
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Abstract
A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element. Furthermore, additional electronic elements are stacked on the carrier according to a similar way to form a stacked electronic package.
Claims7
A stacked package for electronic elements, comprising:
- a substrate, having a supporting surface, wherein a plurality of stud bumps are formed on the supporting surface by a stud bump process and directly contact the supporting surface;
- and
- an electronic element, having a plurality of vias corresponding to the stud bumps, wherein the vias are respectively aligned with the stud bumps to securely mount the electronic element on the substrate.
Dependencies are inferred from the claim text.