Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

A semiconductor device comprising:

• a first chip comprising a first semiconductor device and a first pad, the first pad being electrically connected to the first semiconductor device;
• a second chip comprising a second semiconductor device and a second pad, the second pad being electrically connected to the second semiconductor device;
• a bump between the first chip and the second chip;
• and
• a terminal provided at a rear side of the first chip,
• wherein the first chip and the second chip are electrically connected via the bump, and
• wherein the terminal is electrically connected to the first semiconductor device.

A semiconductor device comprising:

• an interposer;
• a first chip comprising a first semiconductor device over the interposer;
• a second chip comprising a second semiconductor device over the first chip;
• a first wiring and a second wiring on the interposer;
• a first wire;
• a second wire;
• and
• a terminal provided at a rear side of the interposer,
• wherein the first semiconductor device is electrically connected to the first wiring via the first wire,
• wherein the second semiconductor device is electrically connected to the second wiring via the second wire, and
• wherein the terminal is electrically connected to the first semiconductor device.

A semiconductor device comprising:

• a first package;
• a second package over the first package;
• and
• a terminal provided at a rear side of the first package,
• wherein the first package comprises:
• a first interposer;
• a first chip comprising a first semiconductor device over the first interposer;
• a first wiring on the first interposer;
• a first wire;
• and
• a first mold resin,
• wherein the second package comprises:
• a second interposer;
• a second chip comprising a second semiconductor device over the second interposer;
• a second wiring on the second interposer;
• a second wire;
• and
• a second mold resin,
• wherein the first semiconductor device is electrically connected to the first wiring via the first wire,
• wherein the second semiconductor device is electrically connected to the second wiring via the second wire, and
• wherein the terminal is electrically connected to the first semiconductor device.