Stacked-type semiconductor device and method of manufacturing the same
OwnerMasanori Onodera, Kouichi Meguro +1inventors
InventorsMasanori Onodera, Kouichi Meguro, Junichi Kasai
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Abstract
A semiconductor device of a stacked type includes a semiconductor chip (1) that is mounted on a substrate (4), a first sealing resin (12) that seals the semiconductor chip (1), a built-in semiconductor device (9) that is placed on the first sealing resin (12), and a second sealing resin (13) that is formed on the substrate (4) and seals the semiconductor chip (1) and the built-in semiconductor device (9). In this semiconductor device, the semiconductor chip (1) and the built-in semiconductor device (9) are electrically connected to the substrate by bonding wires (3).
Claims8
A semiconductor device of a stacked type, comprising:
- a semiconductor chip that is mounted on a substrate;
- a first sealing resin that seals the semiconductor chip;
- a built-in semiconductor device that is placed on the first sealing resin;
- and
- a second sealing resin that is formed on the substrate and seals the semiconductor chip and the built-in semiconductor device,
- the semiconductor chip and the built-in semiconductor device being electrically connected to the substrate by bonding wires.
A method of fabricating a semiconductor device of a stacked type, comprising the steps of:
- electrically connecting pads on a substrate and a semiconductor chip formed thereon by wires;
- sealing the semiconductor chip with a first sealing resin;
- mounting a built-in semiconductor device on a top surface of the first sealing resin;
- electrically connecting pads on the substrate and the built-in semiconductor device by wires;
- and
- sealing, on the substrate, the built-in semiconductor device and the semiconductor chip with a second sealing resin.
Dependencies are inferred from the claim text.