Vertically integrated system-in-a-package
AssigneeTexas Instruments Incorporated
InventorsMark Gerber, Wyatt Huddleston
Life of this patent
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Abstract
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling one or more surface mount devices to a top surface of a second substrate, coupling the second substrate to a top surface of the first die, interconnecting the first substrate, the second substrate, and the first die, and encapsulating the first die, the second substrate and the surface mount devices.
Claims20
A method of forming a system-in-a-package, comprising:
- providing a first substrate;
- coupling a first die to a top surface of the first substrate;
- coupling one or more surface mount devices to a top surface of a second substrate;
- coupling the second substrate to a top surface of the first die;
- interconnecting the first substrate, the second substrate, and the first die;
- and
- encapsulating the first die, the second substrate and the surface mount devices.
A system-in-a-package, comprising:
- a first substrate;
- a first die coupled to a top surface of the first substrate;
- one or more surface mount devices coupled to a top surface of a second substrate;
- the second substrate coupled to a top surface of the first die;
- the first substrate, the second substrate, and the first die electrically coupled together with a plurality of wirebonds;
- and
- the first die, the second substrate and the surface mount devices encapsulated with a mold compound.
A method of forming a system-in-a-package, comprising:
- providing a first substrate;
- stacking a plurality of die on a top surface of the first substrate;
- coupling one or more surface mount devices to a top surface of a second substrate;
- coupling the second substrate to a top surface of the uppermost die of the stacked die;
- interconnecting the second substrate to the first substrate and at least one of the stacked die;
- and
- encapsulating the stacked die, the second substrate and the surface mount devices.
Dependencies are inferred from the claim text.