Electronic component mounting package and package assembled substrate
AssigneeSanyo Electric Co., Ltd.
InventorsMasanori Hongo, Masami Fukuyama
Life of this patent
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Abstract
A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.
Claims7
An electronic component mounting package having a laminate structure formed by laminating a plurality of ceramic layers, comprising a component mounting surface for mounting at least one electronic component, defined perpendicularly to a laminating direction;
- a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction;
- a recess with an L-shaped cross section across the mount surface and a side surface perpendicular to the mount surface, defined at each end of at least one ceramic layer of the plurality of ceramic layers in a direction perpendicular to the laminating direction;
- and an external electrode for connecting the electronic component to the mother board, formed on each recess, the external electrode having a surface thereof exposed to the mount surface.
A package assembled substrate having a plurality of electronic component mounting packages to be cut out therefrom, the package assembled substrate comprising a laminate structure formed by laminating a plurality of ceramic layers, and an assembled structure in which each package part in the form of a rectangular parallelepiped to be one electronic component mounting package is arranged in the form of a matrix, wherein each package part has a component mounting surface for mounting at least one electronic component, defined perpendicularly to a laminating direction;
- a recess with an L-shaped cross section perpendicular to the laminating direction, defined at each end of at least one ceramic layer of a plurality of ceramic layers constituting one package part in a direction perpendicular to the laminating direction, opposed to two neighboring package parts in two directions;
- and an external electrode for connecting the electronic component to a mother board, formed on each recess, wherein a plurality of package parts can be cut out by cutting along a cutting line separate from the external electrode.
Dependencies are inferred from the claim text.