Ic card and method of manufacturing the same
AssigneeRenesas Technology Corp.
InventorsJunichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
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AssigneeRenesas Technology Corp.
InventorsJunichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
Estimating the term…
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
1-24. (canceled)
A memory card comprising:
A memory card comprising:
Dependencies are inferred from the claim text.