Structure of memory card packaging and method of forming the same
OwnerChin-Tong Liu, Chin-Shu Wuinventors
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Abstract
A structure and a method for a memory card are provided, including a circuit substrate and an encapsulating case. The substrate is completed with chips and circuit connected, and is stamped on the circumferential borders to form a plurality of ribs or gaps. The case is formed by a burying injection molding method on the top side of the substrate to encapsulate the ribs or gaps on the circumferential border of the substrate, so that the case and the substrate are tightly engaged. The structure of the memory card is stronger and water-proof.
Claims13
A structure of memory card, applicable to multimedia card (MMC) or secure digital (SD) card, said structure comprising:
- a circuit substrate, with a plurality of chips placed on said substrate, said substrate having an electrical connection part at the bottom, and a plurality of ribs and gaps on at least two opposite sides of said substrate;
- and
- a case, covering the top side of said substrate, circumferential border of said case forming a frame to encapsulate the circumferential border of said substrate. rodes and said bonding layer are bonded directly to complete said bonding structure.
A packaging method for memory cards, applicable to multimedia card (MMC) or secure digital (SD) card, forming a plurality of ribs and gaps on at least two opposite borders of a circuit substrate with chips and electrical connection, said method comprising the steps of:
- (A) injection molding a protective mask;
- and
- (B) placing said protective mask on the stop side of said substrate, and forming a case on the top side and the circumferential border of said substrate using a burying injection molding method so that the border of said case encapsulating said ribs of said substrate to form a structure of a memory card.
Dependencies are inferred from the claim text.