Low cost hermetically sealed package
AssigneeTexas Instruments Incorporated
InventorsRobert Duboc, Terry Tarn
Life of this patent
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Abstract
Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.
Claims70
A device package, comprising:
- a top substrate:
- a semiconductor substrate of a microstructure device, said semiconductor substrate being bonded to the top substrate forming a first space therebetween;
- a package substrate on which the semiconductor substrate is disposed;
- and
- a package frame that is hermetically bonded to the top substrate and to the package substrate forming a second space between the package frame and package substrate.
A device package, comprising:
- a package substrate;
- a microstructure device comprising top and bottom device substrates that are bonded together so as to form a gap therebetween, wherein a microstructure is disposed within the gap, wherein the bottom device substrate is attached to the packaging substrate;
- and
- wherein the top device substrate is hermetically bonded to the package substrate via a hermetic connector.
A method, comprising:
- providing a top device substrate, a bottom device substrate, an array of reflective deflectable mirror plates, and an array of addressing electrodes associated with the array of mirror plates;
- bonding the top and bottom device substrate so as to form a device assembly, wherein the mirror plates and addressing electrodes are disposed between the top and bottom device substrates;
- disposing the assembly on the packaging substrate;
- and
- hermetically sealing the top device substrate to the packaging substrate such that the mirror plate and addressing electrode arrays are hermetically sealed.
A method of packaging a microstructure device comprising first and second device substrates, comprising:
- hermetically bonding the first device substrate to a packaging substrate so as to form a hermetic device package;
- and
- non-hermetically sealing the hermetic device package between a packaging cover and the packaging substrate.
Dependencies are inferred from the claim text.