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US 2006/0220198 A1Published application
Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress
OwnerRajashree Baskaraninventor
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Abstract
A packaged integrated circuit (IC) is described having an integrated circuit that is electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically conductive material.
Claims24
A packaged integrated circuit (IC) comprising an integrated circuit that is electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically conductive material.
A method, comprising:
- electrically coupling a semiconductor IC to its package by inserting Carbon nanotubes into an electrically conductive material that is in a liquid phase.
An apparatus, comprising:
- a computing system comprising a packaged integrated circuit having circuitry to perform a memory controller function, said integrated circuit being electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically conductive material, said packaged integrated circuit coupled to DDR random access memory.
Dependencies are inferred from the claim text.