Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same
AssigneeEudyna Devices Inc.
InventorMikio Oshima
Life of this patent
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Abstract
A semiconductor device that includes: a metal component that has at least one face sealed with resin; a semiconductor element that is electrically or thermally connected to the metal component; and a protruding portion that is formed on the one face of the metal component by a push from the face opposite to the one face, at least one side of the protruding portion being connected to the metal component, another side of the protruding portion being separated from the metal component.
Claims26
A semiconductor device comprising:
- a metal component that has at least one face sealed with resin;
- a semiconductor element that is electrically or thermally connected to the metal component;
- and
- a protruding portion that is formed by pushing a convex portion formed on the one face of the metal component.
A semiconductor device comprising:
- a metal component that has at least one face sealed with resin;
- a semiconductor element that is electrically or thermally connected to the metal component;
- and
- a protruding portion that is formed on the one face of the metal component by pushing a hole region penetrating the metal component from a face opposite to the one face.
A semiconductor device comprising:
- a metal component that has at least one face sealed with resin;
- a semiconductor element that is electrically or thermally connected to the metal component;
- and
- a protruding portion that is formed on the one face of the metal component by pushing from a face opposite to the one face and having a portion broken away from the metal component.
A metal component that has at least one face sealed with resin, comprising:
- a protruding portion that is formed by pushing a convex portion formed on the one face of the metal component.
A metal component that has at least one face sealed with resin, comprising:
- a protruding portion that is formed on the one face of the metal component by pushing a hole region penetrating the metal component from a face opposite to the one face.
A metal component that has at least one face sealed with resin, comprising:
- a protruding portion that is formed on the one face of the metal component by pushing from a face opposite to the one face and having a portion broken away from the metal component.
A method of manufacturing a semiconductor device, comprising the steps of:
- electrically or thermally connecting a semiconductor element and a metal component that has a protruding portion formed by pushing a convex portion formed on one face of the metal component;
- and
- sealing at least the one face of the metal component including the protruding portion and a semiconductor element with resin.
A method of manufacturing a semiconductor device, comprising the steps of:
- electrically or thermally connecting a semiconductor element and a metal component that has a protruding portion formed on one face of the metal component by pushing a hole region penetrating the metal component from a face opposite to the one face;
- and
- sealing at least the one face of the metal component including the protruding portion and a semiconductor element with resin.
A method of manufacturing a semiconductor device, comprising the steps of:
- electrically or thermally connecting a semiconductor element and a metal component that has a protruding portion that is formed on one face of the metal component having a portion broken away from the metal component by pushing from a face opposite to the one face;
- and
- sealing at least the one face of the metal component including the protruding portion and a semiconductor element with resin.
A method of manufacturing a metal component that has at least one face sealed with resin, comprising the steps of:
- forming a convex portion on the one face of the metal component;
- and
- forming a protruding portion by pushing the convex portion.
A method of manufacturing a metal component that has at least one face sealed with resin, comprising the steps of:
- forming a hole region that penetrates the metal component;
- and
- forming a protruding portion on the one face of the metal component by pushing the hole region from a face opposite to the one face.
A method of manufacturing a metal component that has at least one face sealed with resin, comprising the step of:
- forming a protruding portion having a portion broken away from the metal component on the one face of the metal component by pushing from a face opposite to the one face.
Dependencies are inferred from the claim text.