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US 2006/0220191 A1Published application
Electronic package with a stepped-pitch leadframe
AssigneeHoneywell International Inc.
InventorLance Sundstrom
Life of this patent
Estimating the term…
Abstract
A leadframe for an electronic package is provided. The lead frame includes a plurality of leads each having an outer lead bond and an inner lead bond. The plurality of leads are interconnected by a tie bar. The plurality of leads have a first pitch at an exit or attach point for an electronic package and a second, larger pitch at the outer lead bonds.
Claims16
1-4. (canceled)
An electronic package, comprising:
- a package body;
- and
- a leadframe provided with the package body, the leadframe comprising:
- a plurality of leads;
- the plurality of leads includes a first pitch at an exit or attach point for the package body;
- the plurality of leads terminates outside the body at an outer lead bond at second pitch;
- and
- the first pitch is less than the second pitch.
5 more elements
An electronic package, comprising:
- at least one IC die;
- a package body housing at least one IC die;
- and
- a leadframe coupled to the at least one IC die, wherein;
- a plurality of leads coupled to the at least one IC die;
- the plurality of leads includes a first pitch at an exit or attach point for the package body;
- the plurality of leads terminates outside the body at an outer lead bond at second pitch;
- and
- the first pitch is less than the second pitch.
6 more elements
A flat integrated circuit package, comprising:
- at least one semiconductor die;
- a package body housing the at least one semiconductor die;
- and
- a side-exit leadframe coupled to the at least one semiconductor die, wherein;
- the leadframe includes a plurality of leads;
- the plurality of leads exits a side of the package body at an exit pitch;
- the plurality of leads terminates outside the body at an outer lead bond pitch;
- and
- the exit pitch is less than the outer lead bond pitch.
6 more elements
A flat integrated circuit package, comprising:
- at least one semiconductor die;
- a package body, housing the at least one semiconductor die, the package body includes a plurality of lead attach pads at a pad pitch;
- and
- an external attach leadframe, wherein;
- the leadframe includes a plurality of leads;
- the plurality of leads each include an inner lead bond that attach to respective ones of the plurality of lead attach pads at the pad pitch;
- the plurality of leads each include an outer lead bond that terminates outside the periphery of the package body at an outer lead bond pitch;
- and
- the pad pitch is less than the outer lead bond pitch.
6 more elements
19-20. (canceled)
Dependencies are inferred from the claim text.