Semiconductor module and method of manufacturing the same
AssigneeSanyo Electric Co., Ltd.
InventorsNoriaki Sakamoto, Chikara Kaneta, Yoshihiko Yanase, Yoshiyuki Kobayashi
Life of this patent
Estimating the term…
Abstract
A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.
Claims12
A semiconductor module comprising:
- an island formed of a conductive material;
- a plurality of leads having one ends thereof being disposed in vicinity of the island;
- a resin sealing body which is mounted on the island and arranged such that a back surface of a circuit board on which a semiconductor element is mounted faces upward;
- a sensor or a circuit element which is mounted on the back surface of the circuit board;
- and
- connecting means which electrically connects the circuit board with the leads,
- wherein the island, the resin sealing body, the sensor or the circuit element, and the parts of the leads are sealed using a sealing resin.
A semiconductor module comprising:
- a mounting board having at least an external connection electrode and a pad electrode electrically connected with the external connection electrode;
- a resin sealing body which is disposed in vicinity of the pad electrode of the mounting board and is arranged such that a back surface of a circuit board on which a semiconductor element is mounted faces upward;
- a sensor or a circuit element which is electrically mounted on the back surface of the circuit board;
- connecting means which is used to electrically connect the electrode exposed on the back surface of the circuit board with the pad electrode;
- and
- a sealing resin which allows a back surface of the mounting board to be exposed and seals a surface of the mounting board, the resin sealing body, the sensor or the circuit element and the connecting means.
A method of manufacturing a semiconductor module comprising the steps of:
- preparing a circuit board having at least a first wiring layer on a front surface thereof and a second wiring layer on a back surface thereof;
- mounting a semiconductor element on the first wiring layer;
- forming a resin sealing body by sealing the first wiring layer and the semiconductor element using a first sealing resin;
- mounting a sensor or a circuit element on the second wiring layer;
- placing the resin sealing body on a planar island such that the second wiring layer is exposed upward;
- electrically connecting the second wiring layer with a lead, one end of which is disposed in vicinity of the island;
- and
- collectively sealing the lead, the resin sealing body, and the island using a second sealing resin such that the part of the lead is exposed.
A method of manufacturing a semiconductor module comprising the steps of:
- preparing a circuit board having at least a first wiring layer on a front surface thereof and a second wiring layer on a back surface thereof;
- mounting a semiconductor element on the first wiring layer;
- forming a resin sealing body by sealing the first wiring layer and the semiconductor element using a first sealing resin;
- mounting a sensor or a circuit element on the second wiring layer;
- placing the resin sealing body on a mounting board such that the second wiring layer is exposed upward;
- electrically connecting conductive patterns formed on the top surface of the mounting board with the second wiring layer of the resin sealing body;
- and
- collectively sealing the resin sealing body, and the front surface of the mounting board using the second sealing resin while conductive patterns formed on the back surface of the mounting board being exposed.
A method of manufacturing a semiconductor module comprising the step of:
- preparing a package which includes at least a semiconductor element sealed and an electrode disposed on a back surface thereof;
- mounting a sensor or a circuit element to the electrode located on the back surface;
- mounting the package on a planar island to electrically connect a lead, one end of which is disposed in vicinity of the island, with the package;
- and
- sealing the island, the one end of the lead, and the package.
Dependencies are inferred from the claim text.