Heatsink moldlocks
AssigneesFreescale Semiconductor, Inc., Motorola, Inc.
InventorsAlexander Elliott, L. Mahalingam, William Strom
Life of this patent
Estimating the term…
Abstract
A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination . The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12 do not detract from the purpose of the die attach solder (36).
Claims27
1-22. (canceled)
A heat sink comprising:
- a first mold lock located in a flag area of the heatsink, the first mold lock includes a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel;
- a second mold lock located in an edge area of the heat sink, the second mold lock includes a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel.
A packaged semiconductor, comprising:
- a heatsink including:
- a first mold lock located in an interior area of the heatsink, the first mold lock includes a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel;
- a second mold lock located in an edge area of the heat sink, the second mold lock including a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel;
- a mold compound coupled to the second mold lock.
A packaged semiconductor, comprising:
- a heatsink including:
- a first mold lock, the first mold lock includes a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel;
- a second mold lock, the second mold lock includes a primary channel and a dovetail profile protruding into the primary channel from a wall of the primary channel;
- a die, the die covering the first mold lock;
- a mold compound coupled to the second mold lock.
Dependencies are inferred from the claim text.