High-k thin film grain size control

A method comprising:

• depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate;
• and
• thermally treating the plurality of nano-particles to form a thin film.

A system comprising:

• a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and
• a ceramic material disposed between the first electrode and the second electrode,
• wherein the ceramic material comprises columnar grains.

The system of claim 16, wherein at least one of the first electrode and the second electrode comprises a copper material.

A method comprising:

• depositing a ceramic material to pre-determined locations across a surface of a substrate;
• and
• thermally treating the ceramic material to form a thin film.