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US 2006/0220175 A1Published application
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
AssigneeIntel Corporation
InventorsJohn Guzek, Cengiz Palanduz, Victor Prokofiev
Life of this patent
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Abstract
A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
Claims24
A process of forming a capacitor assembly comprising:
- forming a first and second recess in a laminate, the laminate including a dielectric center film with a first side and a second side;
- a first plate on the first side;
- and a second plate on the second side;
- forming a first film over the first plate, and a second film over the second plate;
- forming a deep first via in the first recess, a shallow first via in the first film, a deep second via in the second recess, and a shallow second via in the second film, wherein the deep first via exposes the conductive second film from the first side and the deep second via exposes the conductive first film from the second side;
- forming a deep first contact in the deep first via and a deep second contact in the deep second via;
- and
- forming an upper first terminal at the deep first contact and a lower second terminal at the deep second contact.
5 more elements
A capacitor assembly comprising:
- a laminate including a dielectric center film with first and second sides;
- a first plate on the first side;
- and a second plate on the second side;
- a first recess in the first plate that exposes the dielectric center film, and a second recess in the second plate that exposes the dielectric center film;
- a first film in the first recess and deep and shallow first vias in the first film, wherein the deep first via exposes the second plate through the first recess, and wherein the shallow first via exposes the first plate from the first side;
- a second film in the second recess and deep and shallow second vias in the second film, wherein the deep second via exposes the first plate in the second recess, and wherein the shallow second via exposes the second plate from the second side;
- and
- a deep first contact in the deep first via, and a shallow first contact in the shallow first via;
- a deep second contact in the deep second via, and a shallow second contact in the shallow second via.
6 more elements
A capacitor composite comprising:
- a laminate including a dielectric center film with first and second sides;
- a first plate on the first side;
- and a second plate on the second side;
- a first recess in the first plate that exposes the dielectric center film, and a second recess in the second plate that exposes the dielectric center film, and wherein the first and second recesses are laterally offset;
- a first film in the first recess and deep and shallow first vias in the first film, wherein the deep first via exposes the second plate through the first recess, and wherein the shallow first via exposes the first plate from the first side;
- a second film in the second recess and deep and shallow second vias in the second film, wherein the deep second via exposes the first plate in the second recess, and wherein the shallow second via exposes the second plate from the second side;
- a deep first contact in the deep first via, and a shallow first contact in the shallow first via;
- a deep second contact in the deep second via, and a shallow second contact in the shallow second via;
- an upper first terminal coupled to the first plate by the deep first contact;
- an upper second terminal coupled to the first plate by the shallow first contact;
- a lower first terminal coupled to the second plate by the deep second contact;
- a lower second terminal coupled to the second plate by the shallow second contact;
- the above structure comprising a capacitor assembly, and
- a spacer coupled to the capacitor assembly.
11 more elements
A computing system comprising:
- a laminate including a dielectric center film with first and second sides;
- a first plate on the first side;
- and a second plate on the second side;
- a first recess in the first plate that exposes the dielectric center film, and a second recess in the second plate that exposes the dielectric center film;
- a first film in the first recess and deep and shallow first vias in the first film, wherein the deep first via exposes the second plate through the first recess, and wherein the shallow first via exposes the first plate from the first side;
- a second film in the second recess and deep and shallow second vias in the second film, wherein the deep second via exposes the first plate in the second recess, and wherein the shallow second via exposes the second plate from the second side;
- a deep first contact in the deep first via, and a shallow first contact in the shallow first via;
- a deep second contact in the deep second via, and a shallow second contact in the shallow second via;
- an upper first terminal coupled to the first plate by the deep first contact;
- an upper second terminal coupled to the first plate by the shallow first contact;
- a die coupled to the upper first terminal;
- a lower first terminal coupled to the second plate by the deep second contact;
- a lower second terminal coupled to the second plate by the shallow second contact;
- at least one of an input device and an output device coupled to the die;
- and
- a dynamic random access storage device coupled to the die.
13 more elements
Dependencies are inferred from the claim text.