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US 2006/0220167 A1Published application
IC package with prefabricated film capacitor
AssigneeIntel Corporation
InventorsYongki Min, Islam Salama
Life of this patent
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Abstract
A method of fabricating an integrated circuit package, comprising prefabricating a film capacitor including forming a first conductive layer, depositing a dielectric layer on the first conductive layer, and depositing a second conductive layer on the dielectric layer; forming a substrate; and laminating the prefabricated film capacitor to the substrate.
Claims29
A method of fabricating an integrated circuit package, comprising:
- prefabricating a film capacitor including
- forming a first conductive layer,
- depositing a dielectric layer on the first conductive layer, and
- depositing a second conductive layer on the dielectric layer;
- forming a substrate;
- and
- laminating the prefabricated film capacitor to the substrate.
4 more elements
An integrated circuit package, comprising:
- a substrate including a plurality of first via pads embedded therein;
- a die mounted to the substrate;
- a prefabricated film capacitor embedded in the substrate and including a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and the second conductive layers;
- the second conductive layer being laminated to the substrate;
- and
- the substrate further including at least one bridge connector configured and disposed to electrically connect one of the plurality of first via pads and the first conductive layer and to form a first die pad, with the first die pad being electrically coupled to the die.
3 more elements
A system, comprising:
- a printed circuit board having a bus;
- an integrated circuit package including a die;
- the package including
- a substrate including a core having a plurality of via pads mounted thereon, the substrate further including a bonding surface,
- a prefabricated film capacitor embedded in the substrate and including a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and the second conductive layers;
- the second conductive layer being laminated to the bonding surface, and
- the substrate further including at least one bridge connector configured and disposed to electrically connect one of the plurality of the via pads and the first conductive layer and to form a die pad, with the die pad being electrically coupled to the die;
- and
- a mass storage device coupled to the bus.
6 more elements
Dependencies are inferred from the claim text.