Semiconductor device and fabrication process thereof
AssigneeFujitsu Limited
InventorsTakuji Tanaka, Hiroshi Nomura, Yasunori Iriyama
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AssigneeFujitsu Limited
InventorsTakuji Tanaka, Hiroshi Nomura, Yasunori Iriyama
Estimating the term…
A semiconductor device includes a semiconductor substrate of a first conductivity type, a well of the first conductivity type formed in the semiconductor substrate, a transistor formed in the well, a diffusion region of a second conductivity type formed in the semiconductor substrate so as to cover a lateral side and a bottom edge of the well, a terminal formed on the semiconductor substrate at an outside part of the diffusion region, and a conductive region contacting with the well, the well being in ohmic contact with the terminal via the conductive region and the semiconductor substrate, the conductive region having an impurity concentration level exceeding an impurity concentration level of the semiconductor substrate.
A semiconductor device, comprising:
A method of fabricating a semiconductor device comprising a semiconductor substrate of a first conductivity type, a well of said first conductivity type formed in said semiconductor substrate, a transistor formed in said well, a diffusion region of a second conductivity type formed in said semiconductor substrate so as to cover a lateral side surface and a bottom edge of said well, a terminal formed on said semiconductor substrate at an outside part of said diffusion region, and a conductive region contacting with said well, said well being in ohmic contact with said terminal via said conductive region and said semiconductor substrate, said conductive region having an impurity concentration level exceeding an impurity concentration level of said semiconductor substrate, said method comprising the steps of:
Dependencies are inferred from the claim text.