CMOS SRAM cells employing multiple-gate transistors and methods fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsZong-Liang Huo, Seung-Jae Baik, In-Seok Yeo, Hong-Sik Yoon, Shi-Eun Kim
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AssigneeSamsung Electronics Co., Ltd.
InventorsZong-Liang Huo, Seung-Jae Baik, In-Seok Yeo, Hong-Sik Yoon, Shi-Eun Kim
Estimating the term…
Complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cells include at least a first inverter formed in a fin-shaped pattern of stacked semiconductor regions of opposite conductivity type. In some of these embodiments, the first inverter includes a first conductivity type (e.g., P-type or N-type) MOS load transistor electrically coupled in series with a second conductivity type (e.g., N-type of P-type) MOS driver transistor. The first inverter is arranged so that active regions of the first conductivity type MOS load transistor and the second conductivity type driver transistor are vertically stacked relative to each other within a first portion of a vertical dual-conductivity semiconductor fin structure. This fin structure is surrounded on at least three sides by a wraparound gate electrode, which is configured to modulate conductivity of both the active regions in response to a gate signal.
A complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cell, comprising:
A complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cell, comprising:
A complementary metal oxide semiconductor static random access memory (CMOS SRAM) cell, comprising:
22-26. (canceled)
Dependencies are inferred from the claim text.