Solid-state image pickup element and method of producing the same
AssigneeFuji Photo Film Co., Ltd.
InventorHideki Kooriyama
Life of this patent
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Abstract
A solid-state image pickup element comprises: a semiconductor substrate; a photoelectric converting portion formed in the semiconductor substrate; a reflective material portion comprising a hole portion wherein the hole portion is located on a surface, on an area in which the photoelectric converting portion is formed, of the semiconductor substrate, the reflective material portion being formed so as to cover a surface of the semiconductor substrate; and an optical waveguide that propagates incident light while confining the light, to guide the light to the photoelectric converting portion, wherein the optical waveguide is configured by a transparent film formed in the hole portion, the transparent film having a light guiding function.
Claims19
A solid-state image pickup element comprising:
- a semiconductor substrate;
- a photoelectric converting portion formed in the semiconductor substrate;
- a reflective material portion comprising a hole portion wherein the hole portion is located on a surface, on an area in which the photoelectric converting portion is formed, of the semiconductor substrate, the reflective material portion being formed so as to cover a surface of the semiconductor substrate;
- and
- an optical waveguide that propagates incident light while confining the light, to guide the light to the photoelectric converting portion,
- wherein the optical waveguide is configured by a transparent film formed in the hole portion, the transparent film having a light guiding function.
A method of producing a solid-state image pickup element which comprises:
- a semiconductor substrate;
- a photoelectric converting portion formed in the semiconductor substrate;
- and an optical waveguide that propagates incident light while confining the light, to guide the light to the photoelectric converting portion, the method comprising:
- a step of forming the optical waveguide including:
- forming a reflective material film so as to cover a surface of the semiconductor substrate in which the imaging section is formed;
- forming, in the reflective material film, a hole portion in a region corresponding to the photoelectric converting portion;
- and
- forming a transparent film in the hole portion, the transparent film having a predetermined refractive index to have a light guiding function.
Dependencies are inferred from the claim text.