Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

A semiconductor-light-emitting-device-mounting member for mounting a semiconductor light-emitting device, the member comprising:

• (a) a highly heat-dissipative member that has:
• (a1) a one side, referred to as a main surface, on which at least two mutually insulated electrode layers to be connected with a semiconductor light-emitting device are formed to provide a device-mounting area for mounting the semiconductor light-emitting device;
• and
• (a2) the opposite side, which is referred to as an outside-connecting surface to be connected with another member;
• and
• (b) a frame-shaped member placed on the main surface of the highly heat-dissipative member so as to surround the device-mounting area;
• the highly heat-dissipative member having a thermal conductivity of at least 10 W/mK and a coefficient of thermal expansion of at most 10×10−6/° C.;
• the device-mounting area having an area that is 1.05 to 4 times the area of the semiconductor light-emitting device to be mounted.