Semiconductor light emitting device and semiconductor light emitting unit

A semiconductor light emitting unit, comprising:

• a substrate having an opening on an upper surface of the substrate and a conductive pattern on the upper surface of the substrate;
• a semiconductor light emitting device provided on the substrate, the semiconductor light emitting device including,
• a mold resin having a cup shape portion on an upper surface of the mold resin;
• a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole;
• a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead;
• a light emitting element mounted on the second section of the first lead in the cup shape portion;
• a wire electrically connecting the light emitting element and the second lead;
• a sealing resin configured to seal the light emitting element and the wire;
• a board provided having a protrusion, the protrusion being provided in the opening of the substrate and in contact with the second section of the first lead;
• and
• a fixing member provided in the hole of the second section of the first lead and a part of the board.

A semiconductor light emitting device, comprising:

• a mold resin having a cup shape portion on an upper surface of the mold resin;
• a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead;
• a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead;
• a light emitting element mounted on the second section of the first lead in the cup shape portion;
• a wire electrically connecting the light emitting element and the second lead;
• a sealing resin configured to seal the light emitting element and the wire;
• and
• means for fixing the second section of the first lead to a part outside of the semiconductor light emitting device.