Micromirror array device with compliant adhesive
AssigneeTexas Instruments Incorporated
InventorsJonathan Doan, Terry Tarn
Life of this patent
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Abstract
A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.
Claims58
A packaged device, comprising:
- a microstructure device having a device substrate;
- a package substrate on which the microstructure device is attached;
- and
- an adhesive layer disposed between the device substrate and the package substrate for bonding the two substrates, wherein the adhesive layer comprises a adhesive component having a modulii of 2 GPa or lower.
A projection system, comprising:
- an illumination system providing illumination light for the projection system;
- a spatial light modulator having an array of micromirrors set forth in claim 101;
- and
- a display target on which reflected light from the spatial light modulated is projected.
A method of packaging a microstructure device having a device substrate with a package having a package substrate, comprising:
- preparing an adhesive material comprising a adhesive component having a modulus of 2 GPa or lower;
- depositing the prepared adhesive material to either one or both of the device substrate and the package substrate;
- and
- bonding the device substrate to the package substrate with the deposited adhesive material.
The method of claim 38, wherein the adhesive component has a modulus of 0.5 GPa or lower.
A spatial light modulator, comprising:
- an array of microstructure devices having a device substrate;
- a package substrate on which the microstructure device is attached;
- and
- an adhesive layer disposed between the device substrate and the package substrate for bonding the two substrates, wherein the adhesive layer comprises a adhesive component having a modulii of 2 GPa or lower.
Dependencies are inferred from the claim text.