Conductive powder and method for preparing the same
AssigneeHitachi Chemical Company, Ltd.
InventorHideji Kuwajima
Life of this patent
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Abstract
Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.
Claims2
1-5. (canceled)
A method for preparing conductive powder which comprises the steps of:
- coating at least part of a surface of roughly spherical copper powder with silver in an amount of 3 to 30% by weight of silver based on an amount of the copper powder while exposing at least a surface of a portion of an alloy portion of silver and copper to prepare roughly spherical and silver-plated copper powder;
- further coating a surface of the roughly spherical and silver-plated copper powder with an aliphatic acid in an amount of 0.02 to 1.0% by weight of the aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder;
- subjecting to surface smoothening treatment of the coated layer of the silver;
- and
- uniformly mixing the copper powder which is roughly spherical and coated with silver and aliphatic acid in an amount of 60 to 92% by weight with silver powder in an amount of 8 to 40% by weight.
Dependencies are inferred from the claim text.