Infrared imaging sensor and vacuum packaging method thereof
OwnerTzong-Sheng Lee, Ping-Wei Lin +3inventors
InventorsTzong-Sheng Lee, Ping-Wei Lin, Hsiang-Fu Chen, Hung-Ti Li, Jeng-Long Ou
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Abstract
An infrared imaging sensor and a vacuum packaging method thereof are described. The infrared imaging sensor includes a ceramic base, a metal cap and an infrared filter. The ceramic base has an infrared imaging chip attached thereon and the metal cap includes a getter deposited on an inner surface of the metal cap. The infrared filter seals an opening of the metal cap. The ceramic base, the metal cap and the infrared filter are heated in a vacuum chamber to activate the getter, and to solder the ceramic base, the metal cap and the infrared filter together thereby vacuum packaging the infrared imaging sensor.
Claims20
An infrared imaging sensor, comprising:
- a ceramic base, wherein an infrared imaging chip is attached on the ceramic base;
- a metal cap having an opening permissible to light, wherein a getter is deposited on an inner surface of the metal cap;
- and
- an infrared filter installed on the metal cap.
A vacuum packaging method of an infrared imaging sensor, comprising:
- providing a ceramic base;
- attaching an infrared imaging chip on the ceramic base;
- providing a metal cap having an opening permissible to light, wherein a getter is deposited on an inner surface of the metal cap;
- providing an infrared filter installed on the metal cap;
- placing the ceramic base, the metal cap and the infrared filter in a vacuum chamber;
- and
- respectively heating the ceramic base, the metal cap and the infrared filter in the vacuum chamber so as to activate the getter and to solder the ceramic base, the metal cap and the infrared filter together.
An infrared imaging sensor, comprising:
- a ceramic base, wherein an infrared imaging chip is attached on the ceramic base;
- a metal cap having an opening permissible to light, wherein a getter is deposited on an inner surface of the metal cap;
- and
- an infrared filter installed on the metal cap, wherein the ceramic base, the metal cap and the infrared filter are respectively heated in a vacuum chamber so as to activate the getter and to solder the ceramic base, the metal cap and the infrared filter together.
Dependencies are inferred from the claim text.